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1) Integrated Manufacturing Solutions (“IMS”).
−Removed: Our IMS business consists of printed circuit board assembly and test, high-level assembly and test and direct-order-fulfillment.
+Added: IMS is a single operating segment consisting of printed circuit board (“PCB”) assembly and test, high-level assembly and test and direct order fulfillment.
This segment generated approximately 80% of our total revenue in 2025.
2) Components, Products and Services (“CPS”).
−Removed: Components include advanced printed circuit boards (“PCBs”), backplanes and backplane assemblies, cable assemblies, fabricated metal parts, precision machined parts, and plastic injected molded parts.
+Added: Components include advanced PCBs, backplanes and backplane assemblies, cable assemblies, fabricated metal parts, precision machined parts, and plastic injected molded parts.
Products include optical, radio frequency (“RF”) and microelectronic design and manufacturing services from our Advanced Microsystems Technologies division;
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and cloud-based smart manufacturing execution software from our 42Q division.
−Removed: Services include design, engineering, and logistics and repair.
+Added: Services include design, engineering, logistics and repair and direct order fulfillment.
CPS generated approximately 20% of our total revenue in 2025.
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Next generation semiconductor emulation and fabrication equipment supporting current and next generation artificial intelligence (“AI”) solutions.
−Removed: Disposable, wearable and consumable products supporting glucose sensing, insulin and drug delivery, cancer treatment, diagnostic cartridges and general health monitoring.
−Removed: Lab diagnostic, life sciences,
−Removed: lab processing equipment, high volume automated labs, point of care and personal use devices.
−Removed: Next generation imagining, monitoring and therapeutic delivery systems.
+Added: Disposable, wearable and consumable products supporting glucose sensing, insulin and drug delivery, cancer treatment and general health monitoring.
+Added: Lab diagnostic, life sciences, lab processing
+Added: equipment, high volume automated labs, point of care and personal use devices.
+Added: Next generation imaging, monitoring and therapeutic delivery systems.
Defense and Aerospace.
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Power conversion and battery management for battery electric vehicles and hybrid electric vehicles.
−Removed: Heavy equipment, agricultural, commercial and passenger vehicles.
+Added: Electronic systems for heavy equipment, agricultural, commercial and passenger vehicles.
Autonomous, driver assistance and remote control vehicle applications.
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Promoting New Product Introduction (“NPI”) and Joint Design Manufacturing (“JDM”) Solutions.
−Removed: As a result of customer feedback and our customers' desire to manage research and development expenses, we offer product design services to develop systems and components jointly with our customers.
+Added: As a result of customer demand and our customers’ desire to manage research and development expenses, we offer product design services to develop systems and components jointly with our customers.
Our NPI services include quick-turn prototyping, supply chain readiness, functional test development, and release-to-volume production.
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We seek to optimize our facilities to provide cost-effective services for our customers.
−Removed: We continue to invest in factory automation, process improvements, robotics and AI to further enhance our efficiency output.
+Added: We continue to invest in factory automation, process improvements, robotics and AI to further enhance our manufacturing efficiency.
We maintain extensive operations in lower-cost locations and we plan to expand our presence as appropriate to meet the needs of our customers.
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Our customers benefit significantly from our experience in these areas, including product cost reduction, minimization of assets deployed for manufacturing, accelerated time-to-market and a simplified supply chain.
−Removed: Key system components we manufacture include high-technology printed circuit boards, printed circuit board assemblies, backplanes and backplane assemblies, cable assemblies, fabricated metal parts, precision machined parts, plastic injected molded parts, memory modules, and optical, RF microelectronics modules.
+Added: Key system components we manufacture include high-technology PCBs, PCB assemblies, backplanes and backplane assemblies, cable assemblies, fabricated metal parts, precision machined parts, plastic injected molded parts, memory modules, and optical, RF microelectronics modules.
These components and sub-assemblies are integrated into a final product or system, configured and tested to our customer’s or the end-customer’s specifications and delivered to the final point of use, with us managing the entire supply chain.
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We provide advanced component technologies, which we believe allow us to differentiate ourselves from our competitors.
−Removed: These advanced technologies include the fabrication of complex printed circuit boards, printed circuit board assemblies, backplanes and backplane assemblies, cable assemblies fabricated metal parts, precision machined parts, plastic injected molded parts, memory modules, and optical, RF and microelectronics modules.
+Added: These advanced technologies include the fabrication of complex PCBs, PCB assemblies, backplanes and backplane assemblies, cable assemblies, fabricated metal parts, precision machined parts, plastic injected molded parts, memory modules, and optical, RF and microelectronics modules.
We utilize a centralized Technology Council to coordinate the development and introduction of new technologies to meet our customers’ needs in various locations and to increase technical collaboration among our facilities and divisions.
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As such, they require global solutions that include regional manufacturing for selected end markets, especially when time to market, local manufacturing or content and best cost solutions are critical objectives.
−Removed: Our global network of manufacturing facilities provides our customers a combination of sites to maximize both the benefits of regional and best cost manufacturing solutions and repair services.
−Removed: In addition to our manufacturing, distribution and repair locations, we support our customers’ logistics and repair requirements through a network of certified partners around the world.
+Added: Our global network of manufacturing facilities provides our customers with flexibility through a combination of sites to maximize both the benefits of regional and best cost manufacturing solutions and repair services, especially in the constantly evolving tariff and geopolitical environments.
+Added: In addition to our extensive network of manufacturing, distribution and repair locations, we support our customers’ logistics and repair requirements through selected certified partners around the world.
Comprehensive IT Systems and Global Supply Chain Management.
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We use state of the art production management systems to manage our procurement and manufacturing processes in an efficient and cost-effective manner.
−Removed: We collaborate with our customers to enable us to respond to their changing component requirements and to reflect any changes in these requirements in our ERP system.
−Removed: This system enables us to forecast
−Removed: future supply and demand imbalances and develop strategies to help our customers manage their component requirements, especially during supply shortages that have affected our industry in the recent past.
+Added: We collaborate with our customers to enable us to respond to their changing
+Added: component requirements and to reflect any changes in these requirements in our ERP system.
+Added: This system enables us to forecast future supply and demand imbalances and develop strategies to help our customers manage their component requirements, especially during supply shortages that have affected our industry in the recent past.
Our enterprise-wide ERP systems provide us with company-wide information regarding component inventories and orders to help optimize inventories, planning and purchasing at the facility level.
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Expertise in Industry Standards and Regulatory Requirements.
−Removed: We maintain compliance with industry standards and regulatory requirements applicable to certain markets, including, among others, medical, automotive and defense and aerospace.
+Added: We have achieved and maintain a comprehensive portfolio of regulatory compliance certifications for some of the most demanding industries, including among others, medical, automotive and defense and aerospace, delivering competitive differentiation in our high availability, mission critical markets.
Our Products and Solutions
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To meet the ever-changing needs across our diverse customer base, we continue to evolve in support of their current and future requirements.
−Removed: PCBAs are at the core of all electronic systems, and we continue to work to ensure that our PCBA manufacturing capabilities are aligned with the requirements for such systems.
−Removed: Printed circuit board assembly involves attaching electronic components, such as integrated circuits, capacitors, microprocessors, resistors, memory modules, and connectors to printed circuit boards.
−Removed: The most common technologies used to attach components to printed circuit boards employ surface mount technology (“SMT”) and pin-through-hole assembly (“PTH”) and press-fit technology for connectors.
−Removed: We use SMT, PTH, press-fit and other attachment technologies focused on miniaturization and increasing the density of component placement on printed circuit boards.
+Added: PCBAs are at the core of all electronic systems, and we continue to work to ensure that our PCBA manufacturing capabilities are aligned with the requirements for such complex systems.
+Added: PCBA involves attaching electronic components, such as integrated circuits, capacitors, microprocessors, resistors, memory modules, and connectors to PCBs.
+Added: The most common technologies used to attach components to PCBs employ surface mount technology (“SMT”) and pin-through-hole assembly (“PTH”) and press-fit technology for connectors.
+Added: We use SMT, PTH, press-fit and other attachment technologies focused on miniaturization and increasing the density of component placement on PCBs.
These technologies, which support the needs of our customers to provide greater functionality in smaller products, include chip-scale packaging, ball grid array, direct chip attach and high-density interconnect.
−Removed: We perform in-circuit and functional testing of printed circuit board assemblies.
+Added: We perform in-circuit and functional testing of PCBAs.
In-circuit testing verifies that all components are properly inserted and attached and that electrical circuits are complete.
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Examples include complex electro-mechanical assemblies, fluid and blood analysis systems, food dispensing equipment, diagnostic medical devices, high-voltage power management systems, rotating x-ray equipment for airport security, particle analyzers for homeland security and motorized magnetic resonance imaging units.
−Removed: Our facilities also support full system level assembly and test and logistic support for a variety of complex electronic systems, including radio base stations and transmission equipment for wireless networks, optical central offices and wireline switching and routing hardware, server and storage systems for data centers, carriers central offices and video streaming service providers, high-volume disposable sensors and drug delivery devices, lab diagnostics, surgical controllers, ultrasound systems, patient monitoring systems, automotive sensor assemblies, and electric vehicle power control systems and modules.
+Added: Our facilities also support full system level assembly and test and logistic support for a variety of complex electronic and electro-mechanical, as well as liquid-cooled heat dissipation devices and systems, including radio base stations and transmission equipment for wireless networks, optical central offices and wireline switching and routing hardware, server and storage systems for data centers, carriers central offices and video streaming service providers, high-volume disposable sensors and drug delivery devices, lab diagnostics, surgical controllers, ultrasound systems, patient monitoring systems, automotive sensor assemblies, and electric vehicle power control systems and modules.
These products require highly specialized manufacturing capabilities and processes, as well as integrated IT systems and, in most cases, rigorous regulatory compliance and certifications.
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The end customer typically places this order by choosing from a variety of possible system configurations and options.
−Removed: Using advanced manufacturing processes and a real-time warehouse management and data control system on the manufacturing floor, we can usually meet a 48-to-72 hour turn-around-time for BTO and CTO requests.
+Added: Using advanced manufacturing processes and a real-time warehouse management
+Added: and data control system on the manufacturing floor, we can usually meet a 48-to-72 hour turn-around-time for BTO and CTO requests.
We support our direct order fulfillment services with logistics that include delivery of parts and assemblies to the final assembly site, distribution and shipment of finished systems and processing of customer returns.
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Our design and engineering groups provide customers with comprehensive services from initial product design and detailed product development to prototyping and validation, production launch and end-of-life support for a wide range of products covering all our market segments.
−Removed: These groups complement our vertically integrated manufacturing capabilities by providing component level design services for printed circuit boards, backplanes and a variety of electro-mechanical systems.
+Added: These groups complement our vertically integrated manufacturing capabilities by providing component level design services for PCBs, backplanes and a variety of electro-mechanical systems.
Our offerings in design engineering include product architecture, detailed development, simulation, test and validation, integration and regulatory and qualification services, and our NPI services include quick-turn prototypes, functional test development and release-to-volume production.
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Printed Circuit Boards.
−Removed: We produce a wide range of multilayer printed circuit boards on a global basis with high layer counts and fine line circuitry.
−Removed: Specialized production equipment along with an in-depth understanding of high-performance laminate materials allow us to fabricate some of the largest form factor and highest speed circuit boards in the industry.
−Removed: Our ability to support NPI and quick-turn fabrication followed by manufacturing in both North America and Asia allows our customers to accelerate their time-to-market as well as their time-to-volume.
−Removed: Standardized processes and procedures make transitioning of products easier for our customers.
−Removed: Our field applications engineering personnel support designers with material selection and design for manufacturability advice.
−Removed: Backplanes and Backplane Assemblies.
−Removed: Backplanes are typically very large printed circuit boards that serve as the backbones of sophisticated electronics products, such as internet routers and switches.
−Removed: Backplane fabrication is significantly more complex than printed circuit board fabrication due to the large size and thickness of the backplanes.
+Added: We produce a wide range of PCBs with multiple layers in our PCB fabrication plants around the world.
+Added: Skilled professionals using specialized production equipment along with an in-depth understanding of sophisticated manufacturing processes and high-performance laminate materials allow us to fabricate some of the largest PCB’s with very complex geometries and features.
+Added: Our ability to support our customers NPI activity with material selection and design for manufacturability advice coupled with very fast PCB fabrication followed by higher volume manufacturing in our PCB fabrication plants around the world allows our customers to accelerate their time-to-market as well as their time-to-volume.
+Added: Backplanes Fabrication and Backplane Assembly.
+Added: Backplanes are typically very large PCBs that serve as the backbones of sophisticated electronics products, such as internet routers and switches, and in a wide variety of other applications.
We assemble backplanes by press-fitting high-density connectors into plated through-holes in the fabricated backplane.
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These advanced assembly processes require specialized equipment and a strong focus on quality and process control.
−Removed: We often perform in-circuit and functional tests on backplane assemblies.
−Removed: We currently have capabilities to manufacture backplanes at greater than 60 layers in sizes up to 26x40 inches and up to a nominal thickness of 0.425 inches and in a wide variety of high-performance laminate materials.
−Removed: These are among the largest and most complex commercially manufactured backplanes and the test equipment we have ensures the quality and performance of these backplane systems is “world class”.
−Removed: We are capable of testing the signal integrity of these backplanes, and often also utilize state of the art x-ray equipment to verify defect-free installation of the new high density/high speed connectors.
+Added: We often perform in-circuit and functional tests on backplane assemblies as well as more complex test to verify signal integrity.
Cable Assemblies.
−Removed: Cable assemblies are used to connect modules, assemblies and subassemblies, including backplane assemblies in electronic systems.
−Removed: We provide a broad range of cable assembly products and services, from cable assemblies and harnesses for automobiles to very complex harnesses for industrial products and semiconductor manufacturing equipment.
−Removed: We also provide mechanical assembly and integration services where we often assemble, integrate and test cables with electromechanical systems or sub-systems.
−Removed: We design and manufacture a broad range of high-speed data, radio frequency and fiber optic cabling products.
−Removed: We build cable assemblies that are used in power systems typically classified as low and medium voltage.
+Added: Cable assemblies are used to connect a wide variety of modules, assemblies and subassemblies, including backplane assemblies in a range of products in medical, industrial, military, data-center or computing, communications and other applications.
+Added: We provide a wide range of cable assembly products of varying degrees of complexity and we provide mechanical assembly and integration services where we often assemble, integrate and test cables with electromechanical systems or sub-systems.
Fabricated Metal Parts.
−Removed: Parts that are fabricated from metal are often used in sub-assemblies and full enclosures, racks or cabinets used to house and protect complex, critical and fragile electronic components, modules and sub-systems so that the system's functional performance is not compromised due to mechanical, environmental or any other use conditions.
−Removed: Our mechanical systems manufacturing services are capable of fabricating mechanical components that range from single parts to complex enclosures, racks or cabinets and we often integrate these with various electronic components and sub-systems including backplane assemblies and cables with power and thermal management, and other sensor and control systems.
+Added: Parts that are fabricated from metal are often used in sub-assemblies and full enclosures, racks or cabinets used to house and protect complex, critical and fragile electronic components, modules and sub-systems.
+Added: We fabricate metal parts that range from single parts to complex enclosures, racks or cabinets and we often integrate these with various electronic components and sub-systems including backplane assemblies and cables.
+Added: We may also install air or liquid based cooling systems especially for data center applications.
Precision Machined Parts.
We offer a suite of world-class precision machining services in multiple locations.
−Removed: We use advanced numerically controlled machines enabling the machining to very tight tolerances and we often perform further assembly services with these components in clean-room environments.
−Removed: Our capabilities include complex medium and large format mill and lathe machining of aluminum, stainless steel, plastics, ferrous and nonferrous alloys and exotic alloys.
−Removed: have helium and hydrostatic leak-test capabilities.
−Removed: By leveraging our established supply chain, we oversee lapping, anodizing, electrical discharge machining, heat-treating, cleaning, laser inspection, painting and packaging.
−Removed: We have specialized facilities supporting machining and complex integration with access to a range of state-of-the-art, computer-controlled machining equipment that can satisfy rigorous demands for production and quality and meet very tight tolerance specifications.
−Removed: With some of the largest horizontal milling machines in the U.S., we are a supplier of vacuum chamber systems for the semiconductor, flat-panel display, LED equipment, industrial, medical and AS9100-certified aerospace markets.
+Added: We use sophisticated equipment that allows us to machine complex parts to very tight tolerances and we often perform further assembly services with these components in clean-room environments.
+Added: Our capabilities include complex medium and large format mill and lathe machining of aluminum, stainless steel, plastics, ferrous and nonferrous alloys and exotic alloys as well as helium and hydrostatic leak-test capabilities.
Plastic Injection Molded Parts.
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Our diverse capability within the plastic injection molding space spans all major markets and industries.
−Removed: We are equipped with nearly 80 plastic injection molding machines with a wide variety of clamping pressures.
Our experienced tooling, process, quality and resin engineers work concurrently using a scientific molding approach to develop cost-effective, highly reliable manufacturing solutions for medical, industrial, defense, multimedia, computing and data storage customers.
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We currently supply a wide range of optical products from 100G to 1.6T supporting optical communication, AI, high performance computing, quantum computing and data center marketplaces.
−Removed: For the medical end market, we develop components and subassemblies that support Sanmina’s medical manufacturing operations for products such as blood analyzers, food contamination analyzers, and specialized optical spectrometers and fluorometers utilizing the latest optical technologies.
+Added: For the medical end market, we develop components and subassemblies that support our medical manufacturing operations for products such as blood analyzers, food contamination analyzers, and specialized optical spectrometers and fluorometers utilizing the latest optical technologies.
In the automotive and industrial end markets, we are working with customers on next generation photonics based LIDAR product offerings.
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VES provides solutions ideal for a wide range of applications including rack scale data storage and AI and machine learning workloads.
−Removed: With advances in interconnect speeds and architectural shifts towards disaggregating storage from compute for scalability and efficiency in large data centers, VES is well positioned to take advantage of these trends.
+Added: With the increasing demand for AI, hybrid cloud and edge solutions for compute workloads in hyperscaler and enterprise data centers, VES is well positioned to take advantage of these trends.
Our SCI subsidiary has provided engineering services, products, manufacturing, test, and depot and repair solutions to the global defense and aerospace industry for more than 60 years.
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Global Services.
−Removed: Sanmina Global Services complements our end-to-end manufacturing strategy by integrating a full range of post-manufacturing and after-market services, engineering, supply chain, manufacturing, logistics, repair and environmentally friendly disposition into a seamless solution for customers, for both Sanmina-manufactured, and non-Sanmina-manufactured products around the world.
−Removed: We provide a wide range of services, including new product introduction, high-level assembly, distribution services and warranty management, life-extension services and end-of-life management as well as programs that focus on reuse, repair, refurbishment, recycle, recover and redesign.
−Removed: Our reverse logistics services include detailed failure analysis and feedback to enhance product design and product quality.
−Removed: Our IT systems provide full traceability of
−Removed: the product’s lifecycle, from manufacturing and distribution to product returns, the repair process, component swaps and product test results.
+Added: Sanmina Global Services complements our end-to-end manufacturing strategy by integrating a full range of post-manufacturing and after-market services, engineering, supply chain, assembly, logistics, repair and environmentally friendly disposition into a seamless solution for customers, for both Sanmina-manufactured, and non-Sanmina-manufactured products around the world.
+Added: We provide a wide range of services, including new product introduction, high-level assembly, configuration and direct order fulfillment services, warranty management, life-extension services and end-of-life management as well as programs that focus on reuse, repair, refurbishment, recycle, recover and redesign collectively designed to minimize landfill waste.
+Added: Our reverse logistics services include detailed failure analysis and feedback to enhance product design and manufacturing quality.
+Added: Our IT systems provide enhanced AI capabilities to address efficiency and effectiveness, as well as full traceability of the product’s lifecycle, from manufacturing and distribution to product returns, the repair process, component swaps and product test results.
Our 42Q division provides an innovative, world-class cloud-based smart manufacturing execution solution that is scalable, flexible, secure and easy to implement.
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Sales to our ten largest customers represented 52% of our net sales in 2025.
−Removed: Motorola represented 10% or more of our net sales in 2024 and 2022.
−Removed: Nokia represented 10% or more of our net sales in 2023 and 2022.
+Added: One customer represented 10.1% of our net sales in both 2025 and 2024 and one customer represented 13.2% of our net sales in 2023.
We typically enter into supply agreements with our major OEM customers with terms ranging from three to five years.
Our supply agreements generally do not obligate the customer to purchase minimum quantities of products.
−Removed: However, the customer is typically liable for the cost of the materials and components we have ordered to meet their production forecast but which are not used, provided that the material was ordered in accordance with an agreed-upon procurement plan.
+Added: However, the customer is typically liable for the cost of the materials, tariffs and components we have ordered to meet their production forecast but which are not used, provided that the material was ordered in accordance with an agreed-upon procurement plan.
In some cases, the procurement plan contains provisions regarding the types of materials for which our customers will assume responsibility.
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Intellectual Property
−Removed: and foreign patents and patent applications relating to, among other things, printed circuit board manufacturing technology, enclosures, cables, memory modules, optical technology, medical devices and computing and storage.
+Added: and foreign patents and patent applications relating to, among other things, PCB manufacturing technology, enclosures, cables, memory modules, optical technology, medical devices, computing and storage, and defense and aerospace.
For other proprietary processes, we rely primarily on trade secret protection.
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We are also subject to occupational safety and health laws, product labeling and product content requirements, either directly or as required by our customers.
−Removed: Proper waste disposal is a major consideration for printed circuit board manufacturers due to the metals and chemicals used in the manufacturing process.
−Removed: Water used in the printed circuit board manufacturing process must be treated to remove metal particles and other contaminants before it can be discharged into municipal sanitary sewer systems.
−Removed: We operate on-site wastewater treatment systems at our printed circuit board manufacturing plants in order to treat wastewater generated in the fabrication process.
+Added: Proper waste disposal is a major consideration for PCB manufacturers due to the metals and chemicals used in the manufacturing process.
+Added: Water used in the PCB manufacturing process must be treated to remove metal particles and other contaminants before it can be discharged into municipal sanitary sewer systems.
+Added: We operate on-site wastewater treatment systems at our PCB manufacturing plants in order to treat wastewater generated in the fabrication process.
Additionally, the electronics assembly process can generate lead dust.
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and Brockville, Ontario.
−Removed: In addition, we have been found liable in a lawsuit alleging operations at our current and former facilities in Orange County, California contributed to groundwater contamination, and also have ongoing investigation activities at and adjacent to a former facility to determine the extent of any soil, soil vapor, and groundwater contamination.
−Removed: Finally, there are some sites, including our acquired facility in Gunzenhausen, Germany,
−Removed: which are known to have groundwater contamination caused by a third-party, and that third-party has provided indemnification to us for the related liability.
+Added: In addition, we are currently responding to a regulatory inquiry relating to environmental conditions at a former facility in Orange County, California and also have ongoing investigation activities at and adjacent to two other former facilities in Orange County to determine the extent of any soil, soil vapor, and groundwater contamination.
+Added: Finally, there are some sites, including our acquired facility in Gunzenhausen, Germany, which are known to have groundwater contamination caused by a third-party, and that third-party has provided indemnification to us for the related liability.
However, in certain situations, third-party indemnities may not be effective to reduce our liability for environmental contamination.
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At Sanmina, we believe our employees are the key to our success.
−Removed: We cultivate an agile, innovative workplace culture fueled by collaboration, diversity, equity and inclusion.
+Added: We cultivate an agile, innovative workplace culture fueled by collaboration and inclusion.
Having highly engaged employees is essential to our culture and achieving our mission.
−Removed: We embrace diverse perspectives and empower our employees to improve our organization, help us innovate, and continuously strengthen our workplace.
+Added: We embrace various perspectives and empower our employees to improve our organization, help us innovate, and continuously strengthen our workplace.
As a founding member of the RBA, its principles are fundamental to our corporate culture and core values and are reflected in our commitments to our customers, stakeholders, employees and communities in which we do business around the world.
−Removed: We have aligned our work programs, processes and procedures to the RBA Code of Conduct to help ensure a safe and
−Removed: positive work environment for our employees that emphasizes learning and professional development, respect for individuals and ethical conduct, and that is facilitated by a direct management-employee engagement model.
+Added: We have aligned our work programs, processes and procedures to the RBA Code of Conduct to help ensure a safe and positive work environment for our employees that emphasizes learning and professional development, respect for individuals and ethical conduct, and that is facilitated by a direct management-employee engagement model.
For over a decade, we have tracked human capital metrics that we consider to be key to our business, including health and safety, career growth and development, turnover, hiring and diversity, equity and inclusion.
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The health and safety of our employees is of utmost importance to us.
−Removed: In the U.S., we are subject to the requirements of the United States Department of Labor’s OSHA and we are guided by the Environmental Health and Safety principles as described in the RBA’s Code of Conduct worldwide.
+Added: In the U.S., we are subject to the requirements of the United States Department of Labor’s OSHA and we are guided by the Environmental Health and Safety principles as
+Added: described in the RBA’s Code of Conduct worldwide.
We conduct regular self-assessments and audits to ensure compliance with our health and safety guidelines and regulatory requirements.
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We recruit the best people for the job without regard to gender, ethnicity or other protected characteristics and it is our policy to comply fully with all domestic, foreign and local laws relating to discrimination in hiring.
−Removed: Diversity, Equity and Inclusion
+Added: Inclusiveness
We are focused on creating a culture of belonging where employees can be their authentic selves and cultivate a workplace where everyone has an opportunity to succeed.
−Removed: Recognizing and respecting our global presence, we strive to maintain a diverse, equitable and inclusive workforce everywhere we operate.
+Added: Recognizing and respecting our global presence, we strive to maintain an inclusive workforce everywhere we operate.
Approximately 49% of our employees worldwide are female and, in the U.S., non-Caucasian employees account for approximately 60% of the employee base.
−Removed: Our diversity, equity and inclusion principles are reflected in our employee training, in particular with respect to our policies against harassment and bullying and the elimination of bias in the workplace.
+Added: Our inclusion principles are reflected in our employee training, in particular with respect to our policies against harassment and bullying and the elimination of bias in the workplace.
Management Engagement Practices
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Jonathan Faust has served as our Executive Vice President and Chief Financial Officer since December 2023.
−Removed: Faust previously served as Global Controller and Head of Corporate Finance & Services of Hewlett Packard Enterprise (“HP”), which he joined in August 2021.
+Added: Faust previously served as Global Controller and Head of Corporate Finance & Services of HP Inc., which he joined in August 2021.
From February 2020 until July 2021, Mr.
−Removed: Faust was Chief Financial Officer of Aruba, a HP company.
−Removed: Faust spent more than 19 years at HP working in various finance roles, most recently as Senior Vice President and Chief Financial Officer – Hybrid IT from August 2018 until January 2020.
+Added: Faust was Chief Financial Officer of Aruba, a Hewlett Packard Enterprise company.
+Added: Faust spent more than 19 years at Hewlett Packard Enterprise (and formerly Hewlett Packard Co.) working in various finance roles, most recently as Senior Vice President and Chief Financial Officer – Hybrid IT from August 2018 until January 2020.
Alan Reid has served as our Executive Vice President of Global Human Resources since October 2012.
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Compared sentence by sentence after normalising whitespace, quotation marks, case and digits, so re-formatting and restated figures do not read as changed language. Wording changes appear as one removal and one addition. The current filing and the prior one are authoritative.