What changed in this filing

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Item 1. Business

2021-11-12 compared with 2020-11-13 · 109 added, 122 removed, 388 unchanged (37% of the section changed)

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2) Components, Products and Services (CPS).

Components include interconnect systems (printed circuit board fabrication, backplane, cable assemblies and plastic injection molding) and mechanical systems (enclosures and precision machining).

Products include memory from our Viking Technology division;

enterprise solutions from our Viking Enterprise Solutions division;

radio frequency (RF), optical and microelectronic;

Components include interconnect systems (printed circuit board fabrication, backplanes, cable assemblies and plastic injection molding) and mechanical systems (enclosures and precision machining).

Products include memory solutions from our Viking Technology division;

high-performance storage platforms for hyperscale and enterprise solutions from our Viking Enterprise Solutions (VES) division;

optical, radio frequency (RF) and microelectronic (microE) design and manufacturing services from Advanced Micro Systems Technologies;

defense and aerospace products from SCI Technology;

and cloud-based manufacturing execution software from our 42Q division.

Services include design, engineering, global services (logistics and repair).

Services include design, engineering and logistics and repair.

CPS generated approximately 20% of our total revenue in 2021.

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Our operations located in lower cost areas engage primarily in higher-volume component and subsystem manufacturing and assembly for both higher and lower complexity products.

As one of the largest global manufacturing solutions providers with operations in 21 countries on six continents we are able to capitalize on our competitive strengths including our:

As one of the largest global manufacturing solutions providers, we are able to capitalize on our competitive strengths including our:

• customer-focused organization with 35,000 employees;

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• product design and engineering resources;

• vertically integrated global manufacturing capabilities;

• vertically integrated global/regional manufacturing capabilities;

• comprehensive IT systems and a flexible global supplier base;

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Capitalizing on Our Comprehensive Solutions.

We intend to capitalize on our end-to-end solutions, which we believe will allow us to sell additional solutions to our existing customers and attract new customers.

Capitalizing on our end-to-end solutions allows us to sell additional solutions to our existing customers and attract new customers.

Our end-to-end solutions include product design and engineering, manufacturing, high-level assembly and test, direct order fulfillment and logistics services, after-market product service and support, and global supply chain management.

Our vertically integrated manufacturing solutions enable us to manufacture additional system components and subassemblies for our customers.

When we provide a customer with a number of services, such as component manufacturing or higher value-added solutions, we are often able to improve our margins and profitability.

When we provide a customer with a number of services, such as component manufacturing or higher value-added solutions, we can often improve our margins and profitability.

Consequently, our goal is to increase the number of manufacturing programs for which we provide multiple solutions.

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We rely on advanced processes and technologies to provide our products, components and vertically integrated manufacturing solutions.

We continually improve our manufacturing processes and develop more advanced technologies, providing competitive advantage to our customers.

We continually improve our manufacturing processes and develop more advanced technologies, providing a competitive advantage to our customers.

We work with our customers to anticipate their future product and manufacturing requirements and align our technology investment activities with their needs.

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We focus our marketing and sales efforts on major end markets within the electronics technology industry.

We target markets we believe offer significant growth opportunities and for which OEMs sell mission critical products that are subject to strict regulatory requirements and/or rapid technological change because the manufacturing of these products requires higher value-added services.

We intend to continue to diversify our business across market segments and customers to reduce our dependence on any particular market or customer.

manufacturing of these products requires higher value-added services.

We seek to diversify our business across market segments and customers to reduce our dependence on any particular market or customer.

Pursuing Strategic Transactions.

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We seek to optimize our facilities to provide cost-effective services for our customers.

We continue to invest in factory automation, process improvements, robotics and AI to further enhance our efficiency output.

We maintain extensive operations in lower cost locations, including Latin America, Eastern Europe, China, Southeast Asia and India, and we plan to expand our presence in these lower cost locations as appropriate, taking into consideration tariffs and other factors, to meet the needs of our customers.

We believe we are well positioned to take advantage of future opportunities on a global basis as a result of our existing manufacturing footprint in 21 countries on six continents.

In March 2020, the World Health Organization declared COVID-19 to be a pandemic, which continues to spread throughout the U.S.

and the world.

During the last nine months of our fiscal 2020, our results of operations were negatively impacted by reduced demand from our customers resulting from the negative impact of the pandemic and government containment measures on their end markets, supply shortages and temporary shutdowns of certain of our facilities.

We are unable to accurately predict the full impact that COVID-19 will have on us due to a number of uncertainties, including the impact of the pandemic on our customers' businesses, the number of employees who may become infected or exposed to infected persons who we would then be required to exclude from our plants, the imposition of government restrictions on staffing and the types of products we are permitted to build, the need for temporary plant closures, supply chain shortages and other interruptions, the duration of the outbreak, the geographic location of any future outbreaks, and actions that government authorities may take.

However, it is likely that the pandemic will continue to have a negative impact on our business, results of operations and financial condition for the foreseeable future.

We believe we are well positioned to take advantage of future opportunities on a global/regional basis as a result of our existing manufacturing footprint in 20 countries on six continents.

Our results of operations have been negatively impacted by rapidly changing market and economic conditions caused by the COVID-19 pandemic, as well as by numerous measures imposed by government authorities to try to contain the virus.

These conditions and measures disrupted our operations and those of our customers, interrupted the supply of components, temporarily limited the types of products we could manufacture and the capacity of our logistics providers to deliver those products, and resulted in temporary closures of manufacturing sites and reduced staffing as mandated by government orders.

Although employee infections have not yet had a significant impact on our operations, these conditions and measures require us to perform contact tracing, exclude potentially infected employees from the workplace and clean work areas used by infected employees.

We are unable to accurately predict the full impact that the COVID-19 pandemic will have on us due to a number of uncertainties, including the duration of ongoing supply chain constraints directly and indirectly caused by the pandemic, the extent of the impact of the pandemic on our customers' businesses, the number of employees who may become infected or exposed to infected persons whom we would then be required to exclude from our plants, the need for temporary plant closures caused by large scale employee infections, the duration of the outbreak, the continued efficacy and availability of COVID-19 vaccines, the geographic locations of any future outbreaks, including outbreaks caused by variants of COVID-19 and actions that government authorities may take in response, such as the potential reimposition of government restrictions on staffing and the types of products we are permitted to build.

However, we believe it is likely that the pandemic will continue to have a negative impact on our business, results of operations and financial condition for the foreseeable future.

Our Competitive Strengths

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Product Design and Engineering Resources.

We provide product design and engineering services for new product designs, cost reductions and Design-for-Manufacturability/Assembly/Test (DFx) reviews.

We provide product design and engineering services for new product designs, cost reductions and Design-for-Manufacturability/Assembly/Test (DFx).

Our engineers work with our customers during the complete product life cycle.

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We focus on industry segments that include industrial, medical, defense and aerospace, automotive, communications networks and cloud solutions.

System solutions for these industry segments are supported by our

vertically integrated component technologies, namely printed circuit boards, backplanes, enclosures, cable assemblies, precision machining, plastics, memory modules, and optical, RF and microelectronics modules.

System solutions for these industry segments are supported by our vertically integrated component technologies, namely printed circuit boards, backplanes, enclosures, cable assemblies, precision machining, plastics, memory modules, and optical, RF and microelectronics modules.

In these engagement models, our customers bring market knowledge and product requirements.

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Key system components we manufacture include high-technology printed circuit boards and printed circuit board assemblies, backplanes and backplane assemblies, enclosures, cable assemblies, plastic injection molded products, precision machined components, optical and RF modules and memory modules.

These components and sub-assemblies are integrated into a final product or system, configured and tested to our customer’s or the end-customer’s specifications and delivered to the final point of use, with Sanmina managing the entire supply chain.

By manufacturing system components and subassemblies ourselves, we enhance continuity of supply and reduce costs for our customers.

In addition, we are able to have greater control over the supply chain of our customers' products.

Customers also benefit from our combined design, technology and manufacturing experience with specific products and markets.

For example, in communications networks, we have 40 years of experience in developing high-speed printed circuit boards (PCBs) and backplanes.

For example, in communications networks, we have over 40 years of experience in developing high-speed printed circuit boards (PCBs) and backplanes.

Examples of products for which our experience and vertically integrated model provide competitive advantage include wireless base stations, network switches, routers and gateways, optical switches, servers and storage appliances, automotive products, avionics and satellite systems, magnetic resonance imaging (MRI) and computer tomography (CT) scanners, and equipment used in semiconductor manufacturing processes, including equipment for photolithography, chemical mechanical polishing, vapor deposition and robotics for wafer transfer.

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We provide advanced component technologies, which we believe allow us to differentiate ourselves from our competitors.

These advanced technologies include the fabrication of complex printed circuit boards, backplanes, enclosures, precision machining and plastic components.

These advanced technologies include the fabrication of complex printed circuit boards, backplanes, enclosures, cable assemblies, precision machining, plastics, memory modules, and optical, RF and microelectronics modules.

For example, we produce some of the most advanced printed circuit boards and backplanes in the world, with up to 70 layers, that are manufactured with a range of low signal loss, high-performance materials and include features such as buried capacitance and thin-film resistors, high-density interconnects and micro via technology.

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We have also developed build-to-order (BTO) and configure-to-order (CTO) systems and processes that enable us to manufacture and ship finished systems in as little as 8 hours after receipt of an order.

We utilize a centralized Technology Council to coordinate the development and introduction of new technologies to meet our customers' needs in various locations and to increase technical collaboration among our facilities and divisions.

We utilize a centralized Technology Council to coordinate the development and introduction of new

technologies to meet our customers' needs in various locations and to increase technical collaboration among our facilities and divisions.

Global Manufacturing Capabilities.

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Our global network of manufacturing facilities in 20 countries provides our customers a combination of sites to maximize both the benefits of regional and low cost manufacturing solutions and repair services, and to help alleviate tariff costs.

Our current repair network is located in an additional eight countries.

In addition to our manufacturing and repair locations in 20 countries, we support our customers’ logistics and repair requirements through a certified partner network worldwide.

We offer customers five regions in which all of our technology and components, integrated manufacturing and logistics solutions can be implemented and can serve both regional and global business needs.

To manage and coordinate our global operations, we employ an enterprise-wide Enterprise Resource Planning (ERP) system at substantially all of our manufacturing locations that operates on a single IT platform and provides us with company-wide inventory planning and purchasing capabilities.

This system enables us to standardize planning and purchasing at the facility level and to help optimize inventory management and improve asset utilization worldwide.

This system enables us to standardize planning and purchasing at the facility level and to help optimize inventory visibility and management, improve asset utilization worldwide and reduce risk throughout the entire product lifecycle.

Our systems also enable our customers to receive key information regarding the status of their programs.

We purchase large quantities of electronic components and other materials from a wide range of suppliers.

We are committed to selecting ethical business partners that adhere to the Responsible Business Alliance (RBA) Code of Conduct.

Our primary supply chain goal is to consolidate our global spend to create the synergy and leverage to drive our supply base for better cost competitiveness, more favorable terms and leading-edge supply chain solutions.

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Supply chain management also involves the planning, purchasing, transportation and warehousing of product components.

A key objective of our supply chain management services is to reduce excess component inventory in the supply chain by scheduling deliveries of components at a competitive price and on a just-in-time basis.

We use sophisticated production management systems to manage our procurement and manufacturing processes in an efficient and cost effective manner.

We use state of the art production management systems to manage our procurement and manufacturing processes in an efficient and cost effective manner.

We collaborate with our customers to enable us to respond to their changing component requirements and to reflect any changes in these requirements in our ERP system.

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We believe customer relationships are critical to our success and we are focused on providing a high level of customer service.

Our key customer accounts are managed by dedicated account teams, including a global account manager directly responsible for account management.

Global account managers coordinate activities across divisions to effectively satisfy our customers' requirements and have direct access to our senior management to quickly address customer opportunities and needs.

Local customer account teams further support the global teams.

Account teams led by global account managers are directly responsible for account management.

Global account managers coordinate the additional resource required to facilitate the customer-specific solutions.

As needed, these teams may include subject matter experts in design, specific technology components, services, products, and supply chain.

These teams create the hub for interaction between the customer and our locations, providing local support to customer worldwide.

Expertise in Serving Diverse End Markets.

We have experience in serving our customers in the industrial, medical, defense and aerospace, automotive, communications networks and cloud solutions end markets.

Our diversification across end markets reduces our dependence upon any one customer or segment.

Our diversification across end markets reduces our dependence upon any one customer or end market.

In order to cater to the specialized needs of customers in particular market segments, we have dedicated personnel, and in some cases facilities, with industry-specific capabilities and expertise.

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Our Products and Solutions

We offer our OEM customers a diverse set of products and solutions with a focus on wireless, wireline and optical communications and network infrastructure equipment, such as switches, routers and base stations, computing and storage systems, defense and commercial avionics and communications, medical imaging, diagnostic and patient monitoring systems, point-of-sale, gaming systems, semiconductor tools for metrology, lithography, dry and wet processing, industrial products, including large format printers and automated teller machines, energy and clean technology products such as solar and wind products, LED lighting, smart meters and battery systems, electric vehicle power control systems, automotive infotainment devices, and automotive engine-control modules.

We offer our OEM customers a diverse set of products and solutions with a focus on wireless, wireline and optical communications and network infrastructure equipment, such as switches, routers and base stations, computing and storage systems, defense and commercial avionics and communications, medical imaging, diagnostic and patient monitoring systems, semiconductor tools for metrology, lithography, dry and wet processing, industrial products, including large format printers and automated teller machines, energy and clean technology products such as solar and wind energy components, LED lighting, smart meters and battery systems, electric vehicle power control (and charging) systems, automotive infotainment devices, and automotive engine-control modules.

These products may require us to use some or all of our end-to-end solutions, including design, component technologies and logistics and repair services.

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Printed Circuit Board Assembly and Test.

Printed circuit board assembly involves attaching electronic components, such as integrated circuits, capacitors, microprocessors, resistors and memory modules, to printed circuit boards.

The most common technologies used to attach components to printed circuit boards employ surface mount technology (SMT)

and pin-through-hole assembly (PTH).

SMT is an automated assembly system that places and solders components to the printed circuit board.

In PTH, components are inserted into holes punched in the circuit board.

Another method is press-fit-technology, in which components are pressed into holes on the printed circuit board.

We use SMT, PTH, press-fit and other attachment technologies that are focused on miniaturization and increasing the density of component placement on printed circuit boards.

To meet the ever-changing needs across our diverse customer base, we continue to evolve in support of their current and future requirements.

PCBAs are at the core of all electronic systems, and we continue to work to ensure that our PCBA manufacturing capabilities are aligned with the requirements for such systems.

Printed circuit board assembly involves attaching electronic components, such as integrated circuits, capacitors, microprocessors, resistors, memory modules, and connectors to printed circuit boards.

The most common technologies used to attach components to printed circuit boards employ surface mount technology (SMT) and pin-through-hole assembly (PTH) and press-fit technology for connectors.

We use SMT, PTH, press-fit and other attachment technologies focused on miniaturization and increasing the density of component placement on printed circuit boards.

These technologies, which support the needs of our customers to provide greater functionality in smaller products, include chip-scale packaging, ball grid array, direct chip attach and high density interconnect.

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We perform functional tests to confirm the board or assembly operates in accordance with its final design and manufacturing specifications.

We either design and procure test fixtures and develop our own test software, or we use our customers' test fixtures and test software.

We design and procure test fixtures and develop our own test software or use our customers' test fixtures and test software.

In addition, we provide environmental stress tests of the board or assembly that are designed to confirm that the board or assembly will meet the environmental stresses, such as heat, to which it will be subjected.

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We provide high-level assembly and test in which assemblies and modules are combined to form complete, finished products.

Products for which we currently provide high-level assembly and test include electro-mechanical assemblies, sterilized fluid and blood analysis systems, food dispensing equipment, diagnostic medical devices, high-voltage power management systems, rotating x-ray equipment for airport security, particle analyzers for homeland security, motorized magnetic resonance imaging units, radio base stations and transmission equipment for 5G wireless networks, optical central stations and wireline switching and routing hardware, server and storage systems for data centers, carriers central offices and video streaming service providers.

These products require highly specialized manufacturing capabilities and, processes and integrated IT systems.

Our specialized processes such as cable routing, pulley, gear assembly, lubrication, sterilization, hi-pot voltage testing for safety, functional calibration, liquid management, refrigeration systems, food-grade treatment of surfaces, containers and conduits, x-ray and magnetic testing, battery assembly and test, loading and configuration of firmware and software regionalization based on customer needs and supply chain optimization for large, bulky, or otherwise logistic-intensive and for tariff minimization.

Examples include complex electro-mechanical assemblies, fluid and blood analysis systems, food dispensing equipment, diagnostic medical devices, high-voltage power management systems, rotating x-ray equipment for airport security, particle analyzers for homeland security and motorized magnetic resonance imaging units.

Our facilities also support full system level assembly and test and logistic support for a variety of complex electronic systems, including radio base stations and transmission equipment for 5G wireless networks, optical central offices and wireline switching and routing hardware, server and storage systems for data centers, carriers central offices and video streaming service providers, surgical controllers, ultrasound systems, patient monitoring systems, automotive sensor assemblies and power control modules.

With decades of experience in automated system assembly and test, we have focused on glucose meters, disposable sensors, IOT communication modules and disposable drug delivery systems.

These products require highly specialized manufacturing capabilities and processes, as well as integrated IT systems and, in some cases, industry-specific certifications.

Direct-Order-Fulfillment.

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The end customer typically places this order by choosing from a variety of possible system configurations and options.

Using advanced manufacturing processes and a real-time warehouse management and data control system on the manufacturing floor, we can meet a 48 to 72 hour turn-around-time for BTO and CTO requests.

Using advanced manufacturing processes and a real-time warehouse management and data control system on the manufacturing floor, we can usually meet a 48 to 72 hour turn-around-time for BTO and CTO requests.

We support our direct-order-fulfillment services with logistics that include delivery of parts and assemblies to the final assembly site, distribution and shipment of finished systems and processing of customer returns.

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We have the ability to produce multilayer printed circuit boards on a global basis with high layer counts and fine line circuitry.

We have also developed several proprietary technologies and processes which improve

electrical performance, connection densities and reliability of printed circuit boards.

We currently produce printed circuit boards with up to 70 layers and circuit trace widths as narrow as two mils (50 microns).

Specialized production equipment along with an in-depth understanding of high performance laminate materials allow us to fabricate some of the largest form factor and highest speed circuit boards in the industry.

Our ability to support NPI and quick-turn fabrication followed by manufacturing in both North America and Asia allows our customers to accelerate their time-to-market as well as their time-to-volume.

Standardized processes and procedures make transitioning of products easier for our customers.

Our technology roadmaps provide leading-edge capabilities and high yielding processes.

Our engineering teams are available on a worldwide basis to support designers in Design for Manufacturability (DFM) analysis and assemblers with field applications support.

Printed circuit boards are made of fiberglass/resin-laminated material layers and contain copper circuits which interconnect and transmit electrical signals among the components that make up electronic systems.

Increasing the density of the circuitry in each layer is accomplished by reducing the width of the circuit traces and placing them closer together in the printed circuit board along with adding layers and via hole structures.

We are currently capable of efficiently producing printed circuit boards with up to 70 layers and circuit trace widths as narrow as two mils (50 microns) in production volumes.

Our worldwide engineering teams support designers in Design for Manufacturability (DFM) analysis and assemblers with field applications support.

Backplanes and Backplane Assemblies.

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Plastic Injection Molded Products.

Plastic injection molded products are used to create a vast array of everyday items;

from very small intricate mechanical components, to cosmetic enclosures designed to protect sensitive electronic equipment.

Plastic injection molded products are used to create a vast array of everyday items, from very small intricate mechanical components, to cosmetic enclosures designed to protect sensitive electronic equipment.

Our diverse capability within the plastic injection molding space spans all major markets and industries.

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Our mechanical systems manufacturing services are capable of fabricating mechanical components, such as cabinets, chassis (via soft tool and hard progressive tools), frames, racks, and data storage enclosures integrated with various electronic components and sub-systems with power management, thermal management, sensing functions and control systems.

We manufacture a broad range of enclosures for a wide range of products from set-top boxes, medical equipment, alternative energy storage, data management shelves as well as data storage, to large and highly complex mechanical systems, such as those used in indoor and outdoor wireless base station products and high precision vacuum chambers for the semiconductor, telecom, networking, healthcare, aerospace and homeland security industries.

We manufacture a broad range of enclosures for a wide range of products from set-top boxes, medical equipment, alternative energy storage, data management shelves and data storage, to large and highly complex mechanical systems, such as those used in indoor and outdoor wireless base station products and high precision vacuum chambers for the semiconductor, telecom, networking, healthcare, aerospace and homeland security industries.

Our mechanical systems expertise is available at several of our state-of-the-art facilities worldwide.

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We have dedicated facilities supporting machining and complex integration with access to a range of state-of-the-art, computer-controlled machining equipment that can satisfy rigorous demands for production and quality meeting very tight tolerances.

This includes fully automated “lights-out” machinery that continues production in the absence of human operators that can operate 24/7.

This includes fully automated “lights-out” machinery that continues production in the absence of human operators and can operate 24/7.

With some of the largest horizontal milling machines in the U.S., we are a supplier of vacuum chamber systems for the semiconductor, flat-panel display, LED equipment, industrial, medical and AS9100-certified aerospace markets.

Optical Technology .

Optical Technology is our high-end product technology and engineering division that focuses on RF, optical and microelectronics products.

Our mission and philosophy are to deliver leading-edge technology solutions that help optimize the value and performance of our customers’ applications.

Optical and radio frequency (RF) components are key building blocks of many systems.

We produce both passive and active optical components as well as modules that are built from a combination of industry standard and/or custom components, interconnected using microelectronic and micro-optic technologies to achieve a unique function.

Based on microelectronic design and manufacturing technologies, we provide RF and optical components, modules and systems for customers in the communications, networking, medical, industrial, military and aerospace markets.

Our experience in RF and optical communication and networking products spans long-haul/ultra-long-haul and metro regions for transport/transmission, as well as access and switching applications, including last-mile solutions.

We are currently supplying product to the 10G, 40G, 100G, 200G and 400G optical communication marketplace based on foundational IP within optical and RF technologies.

In the medical market, we develop and manufacture components and subassemblies that support Sanmina’s medical operations for products such as blood analyzers, food contamination analyzers, and specialized optical spectrometers and fluorometers utilizing the latest optical technologies.

Our optical technology service offerings are designed to deliver end-to-end solutions with special focus on product design, test infrastructure development and industrialization, optical, millimeter waive and RF components and module and blade manufacturing, as well as system integration and test.

Advanced Micro Systems Technologies .

Optical and radio frequency (RF) components built off of advanced micro-electronics are key building blocks of many systems.

Our Advanced Micro Systems Technologies product technology and engineering division focuses on optical, RF and microelectronics (microE) design and manufacturing services.

Our mission is to deliver leading-edge technology solutions that enable our customer products while optimizing the value and performance of our customers’ applications.

Based on our microelectronic design and advanced manufacturing technologies, built off Advanced Micro Systems Technologies foundational IP, we provide RF and optical components, modules and systems for customers across many industries including the communications, networking, automotive, medical, industrial, military and aerospace markets.

Within the Advanced Micro Systems Technologies Division, we produce both passive and active optical components as well as modules that are built from a combination of industry standard and/or custom components and interconnected using microelectronic and micro-optic technologies to achieve a unique function.

Our experience in RF and optical communication and networking products spans long-haul/ultra-long-haul and metro applications for transport/transmission, as well as broadband access and switching applications, including last-mile solutions.

We currently supply optical products ranging from 10G to 400G to the optical communication marketplace.

For the medical end market, we develop components and subassemblies that support Sanmina’s medical manufacturing operations for products such as blood analyzers, food contamination analyzers, and specialized optical spectrometers and fluorometers utilizing the latest optical technologies.

In the automotive and industrial end markets, we are working with customers on next generation photonics based Lidar product offerings.

Our Advanced Micro Systems Technologies service offerings are designed to deliver end-to-end solutions with special focus on product design, test infrastructure development and commercialization, along with optical module and mmWave RF components and module manufacturing.

Customers can couple these components with Sanmina’s broader IMS services of blade server manufacturing, as well as system integration and test, providing a complete end-to-end solution for their customers.

Viking Technology.

Viking Technology supplies leading edge Solid State Drives (SSD), DRAM memory modules and Non-Volatile DIMMs (NVDIMM), along with state-of-the-art multi-chip memory packaging (MCP) solutions.

Viking Technology provides DRAM memory & Flash storage solutions ranging from high-performance computing SSDs tailored for the enterprise market to small form factor flash and DRAM modules optimized for industrial, telecommunications, and military markets.

To continue its leadership in the memory space, Viking Technology is investing in several advanced technologies such as memory packaging, multi-chip packaging, system-in-package, and storage class memory.

These investments will enable Viking Technology to support a wider range of markets and applications.

Viking Technology supplies leading edge Solid State Drives (SSD), DRAM memory modules and Non-Volatile DIMMs (NVDIMM), along with state-of-the-art Microelectronics Multi-Chip Package (MCP) memory solutions.

Viking Technology provides DRAM memory and flash storage solutions, including high-performance computing SSDs tailored, high reliable / high performance small form factor flash and DRAM modules, to diverse application for the networking, industrial, data center, transportation, medical, AI to military markets.

To continue its leadership in the memory space, Viking Technology has invested in several advanced packaging technologies and products, such as multi-chip packaging, system-in-package, and rugged, reliable and secure storage class memory solutions.

These investments have enabled Viking Technology to support a wider range of markets and applications.

Viking Technology will continue its focus on the enterprise and embedded markets with further emphasis on markets such as military, defense and aerospace and industrial/automotive applications.

Viking Technology's comprehensive memory product offerings include Enterprise Class & Industrial Grade SSDs available across a wide portfolio of standard and OEM customized form-factors (2.5”, 1.8” SlimSATA, mSATA, M.2, PCIe/NVMe SSDs, SATADIMM™, DFC and eUSB).

Viking Technology also supports the broadest range of DDR4, DDR3, DDR2, DDR and SDRAM modules;

from High-Density to Small-Form Factor with Error Checking and Correction (ECC Memory).

Viking Technology also specializes in DRAM and Flash Multi-chip packaging (MCP) technology, allowing for higher density packages optimized for the military aerospace, autonomous vehicles, and communications satellite applications.

Viking’s ParallelCell family of products are multi-chip package (MCP) solutions that are bare silicon die and wafer level stacking solutions, capable of reducing the overall footprint of memory modules into a single chip.

These MCP solutions are tested in industrial, extended and military temperature ranges.

Viking MCP memory products are designed for applications in which Size, Weight and Power (SWaP) are key requirements.

Our future generations of MCPs will be optimized for radiation tolerant and space compliant applications.

Viking Enterprise Solutions.

Viking Enterprise Solutions is a market leader in high-performance storage platforms for hyperscale and enterprise data centers worldwide.

Viking Enterprise Solutions (VES) is a market leader in high-performance storage platforms for hyperscale and enterprise data centers worldwide.

Leveraging our portfolio of proven product designs, Viking Enterprise Solutions provides advanced data center products, including NVMe flash memory and disk-based storage server appliances, JBOD storage systems and related products for a variety of storage and data center applications including rack scale solutions.

With advances in interconnect speeds and architectural changes to disaggregate storage and compute for scale, Viking Enterprise Solutions is well positioned with a product portfolio to take advantage of these trends.

Viking Enterprise Solutions provides end-to-end, design and manufacturing solutions for both platform-based and fully customized data center products.

VES provides end-to-end, design and manufacturing solutions for both platform-based and fully customized data center products.

From our US-based design and development team, we provide a full array of design services from early product conceptualization, through design, product validation and world-wide product certifications.

In addition, our team supports all phases of product manufacturing, including NPI, support for unique product configurations, RMA and product end-of-life support.

In addition, VES supports all phases of product manufacturing, including NPI, support for unique product configurations, RMA and product end-of-life support.

SCI Technology Inc.

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SCI has the infrastructure and facility security clearance to support the stringent certifications, regulations, processes and procedures required by these customers.

42Q provides an innovative, world-class cloud-based manufacturing execution solution (MES) that is scalable, flexible, secure and easy to implement.

Our solution provides customers advantages in efficiencies and costs relative to legacy systems and offers traceability and genealogy, multi-plant visibility, compliance management and on-demand work instructions.

Global Services.

Our global services focus on highly complex and mission-critical products and processes.

We support the logistics and repair needs of customers in the communications, defense, embedded computing and medical markets worldwide.

Through our operational infrastructure of 34 Sanmina sites and 27 repair partner sites, we provide a wide range of services, including direct-order-fulfillment, configure-to-order, supplier, inventory and warranty management, reverse logistics, repair, asset recovery, sustaining engineering, test development and end-of-life management to embrace the specific needs of our customers.

Drawing on a robust set of information systems, we offer configurable environments tailored to meet specific customer needs, including customized web portals, order and serial number tracking, special routings and promotions.

Local, regional and global solutions are supported by a robust set of business processes that focus on inventory reduction and risk mitigation.

We offer fulfillment and integration services, after-market services and life cycle management services to support the needs of customers in the communications, embedded computing, medical, industrial, 3D printing, and automotive markets worldwide.

Through our operational infrastructure of 30 Sanmina Global Services sites and a 31 site qualified repair partner network, we provide a wide range of services, including direct-order-fulfillment, integration and configure-to-order, high-level assembly, inventory and warranty management, repair, refurbishment, manufacturing, triage screening, advanced exchange, life-extension services, end of life and obsolescence management as well as sustaining and reverse engineering.

Local, regional and global solutions are supported by a robust set of business processes that focus on quick-turn, inventory reduction and risk mitigation.

This can improve cycle times by leveraging infrastructure, people and technology to enable reliable shipments of products to end users worldwide generally within 24 to 72 hours, depending on our customer’s requirements.

Logistics and repair services complement our end-to-end manufacturing strategy by integrating engineering, supply chain, manufacturing, logistics and repair into a seamless solution for customers around the world.

Global Services complement our end-to-end manufacturing strategy by integrating engineering, supply chain, manufacturing, logistics and repair into a seamless solution for customers, for both Sanmina manufactured, and non-Sanmina manufactured products around the world.

42Q provides an innovative, world-class cloud-based manufacturing execution solution (MES) that is scalable, flexible, secure and easy to implement.

Our solution provides customers advantages in efficiencies and costs relative

to legacy systems and offers traceability and genealogy, multi-plant visibility, compliance management and on-demand work instructions.

Our End Markets

We target markets that we believe offer significant growth opportunities and where OEMs sell complex mission critical products that are subject to strict regulatory requirements and/or rapid technological change.

We believe that markets involving complex, rapidly changing products offer opportunities to produce products with higher margins because they require

higher value-added manufacturing services and may also include our advanced vertically integrated components.

We target markets that we believe offer significant growth opportunities and in which OEMs sell complex mission critical products that are subject to strict regulatory requirements and/or rapid technological change.

We believe that markets involving complex, rapidly changing products offer opportunities to produce products with higher margins because they require higher value-added manufacturing services and may also include our advanced vertically integrated components.

Our diversification across market segments and customers helps mitigate our dependence on any particular market or customer.

Industrial/Medical/Defense/Automotive

We provide end-to-end component, engineering and complex assembly services to the industrial market.

We provide design and engineering, end-to-end component and complex assembly services to the industrial market.

We support a wide range of segments, including transportation, power management, industrial controls, instrumentation and test equipment, inspection and public safety equipment, capital equipment, and self-service kiosk solutions.

Our significant experience in the precision machining of components is utilized in highly complex systems such as vacuum chambers, photolithography tools, etch tools, wafer handling systems, airport security, 3D printing, flat panel display test and repair equipment, chem-mech planarization tools, optical inspection and x-ray equipment, explosive detection equipment, and large format printing machines.

We have specialized and dedicated facilities for the assembly of large / complex electro-mechanical, thermal and liquid-management equipment for applications, including ATMs, beverage dispensing, cash-counting and management systems, electro-mechanical patient transfer tables, industrial printers and semiconductor capital equipment.

We also manufacture sub-assemblies for machine-control units, such as high-speed machining tools, liquid management equipment and complex hydraulic-electro-mechanical systems, for applications such as industrial-grade printing and liquid dispensing.

We have specialized and dedicated facilities for the assembly of large / complex electro-mechanical, thermal and liquid-management equipment for applications, including ATMs, beverage dispensing, cash-counting and management systems, industrial printers and semiconductor capital equipment.

We are committed to serving companies that are leading the energy and clean technology revolution in the solar, wind, battery systems, LED lighting fixtures (including indoor, outdoor, industrial-grade and construction lighting products), and smart infrastructure industries.

We leverage traditional EMS for clean technology customers in areas related to power electronics, control and distribution, smart meters and full-system integration of complex industrial power inverters.

Beyond traditional EMS, our extensive range of electro-mechanical design and complex system manufacturing capabilities are an excellent fit across all clean technology segments.

Clean technology customers benefit from our end-to-end solutions in areas related to power electronics, control and distribution, smart meters and full-system integration of complex industrial power inverters.

In addition, our extensive range of electro-mechanical design and complex system manufacturing capabilities are an excellent fit across all clean technology segments.

Our design and manufacturing operations are strategically located in close proximity to clean technology business hubs.

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In addition to complying with these standards, our medical facilities comply with ISO 13485 (formerly EN 46002) and ISO 9001, where required.

We manufacture components, sub-assemblies and systems for a broad range of medical devices, including blood glucose meters, computed tomography scanner assemblies, respiration systems, blood analyzers, molecular diagnostics, cosmetic surgery systems, ultrasound imaging systems and a variety of patient monitoring equipment.

We offer our end-to-end services to the defense, aerospace and high-reliability electronics industry.

We design, manufacture and support a comprehensive range of defense and aerospace products, including avionics systems and processors, cockpit and wireless communications systems, tactical and secure network communications systems, radar subsystems, machine vision systems, unmanned aircraft airframes and avionics, and fiber-optic systems for defense related applications.

We manufacture components, sub-assemblies and systems for a broad range of medical devices, including blood glucose meters, disposable sensors and insulin pumps, computed tomography scanner assemblies, respiration systems, blood analyzers, molecular diagnostic systems, cosmetic surgery systems, ultrasound imaging systems and a variety of patient monitoring equipment.

We provide our end-to-end services to the defense, aerospace and high-reliability electronics industry.

We believe our experience, as well as product design and engineering capabilities, are key competitive strengths in these markets.

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Substantially all of our automotive facilities are IATF 16949 certified and produce printed circuit boards, printed circuit board assemblies, cable assemblies and higher level electronic assemblies.

Communications Networks & Cloud Solutions

Communications Networks.

In the communications sector, we leverage our extensive product design and engineering capabilities to develop and manufacture advanced communications productions and components for LTE, 5G and microwave wireless RF filters and antennas, wireline access, switching, routing, optical networking and transmission and enterprise networking systems.

Products we manufacture include wireless base stations, remote radio heads and small cells, point-to-point microwave systems and other fronthaul/backhaul solutions, satellite receivers and various radio frequency appliances, optical PON, metro and long-haul,

transmission hardware and switching along with core, service and edge routers.

In the communications sector, we leverage our extensive product design and engineering capabilities to develop and manufacture advanced communications products and components for LTE, 5G and microwave wireless RF filters and antennas, wireline access, switching, routing, optical networking and transmission and enterprise networking systems.

We also design and manufacture advanced optical, RF and microelectronic components which are key elements in many of these products.

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In addition, we manufacture a broad range of products with embedded processor capabilities, including digital home gateways, professional audio-video equipment, a variety of touch-screen equipment and internet connected entertainment devices.

Our vertical integration capabilities include racks, enclosures, cables, complex multi-layer printed circuit boards, printed circuit assemblies and backplanes, fiber optics and high-level assembly and test, direct order fulfillment and repair services.

Our vertical integration capabilities include racks, enclosures, cables, complex multi-layer printed circuit boards, printed circuit board assemblies and backplanes, fiber optics and high-level assembly and test, direct order fulfillment and repair services.

In addition, we have designed and developed some of the most compact and powerful storage modules available in the market today, which we have coupled with our global, vertically integrated supply chain to deliver some of the most compelling embedded computing and storage solutions to the data storage industry.

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Sales and Marketing

Our sales efforts are organized and managed on a regional basis with regional sales managers in geographic regions throughout the world.

We develop relationships with our customers and market our vertically integrated manufacturing solutions through our direct sales force and marketing and sales staff.

Our sales resources are directed at multiple management and staff levels within target accounts.

Our direct sales personnel work closely with the customers' engineering and technical personnel to understand their requirements.

Our sales and marketing staff supports our business strategy of providing end-to-end solutions by

encouraging cross-selling of vertically integrated manufacturing solutions and component manufacturing across a broad range of major OEM products.

To achieve this objective, our marketing and sales staff works closely with our various manufacturing and design and engineering groups and engages in marketing and sales activities targeted at key customer opportunities.

Each of our key customer accounts is managed by an account team, including a global account manager directly responsible for account management.

Global account managers coordinate activities across divisions to satisfy customer requirements and have direct access to our senior management to quickly address customer concerns.

Local customer account teams further support the global teams.

We develop relationships with our customers and market our vertically integrated manufacturing solutions through our sales and marketing staff.

Our sales team works closely with our customers' engineering and technical personnel to understand

their strategy and roadmaps to enable their go-to-market strategy.

Our sales and marketing staff supports our business strategy of providing end-to-end solutions by encouraging cross-selling vertically integrated manufacturing solutions and component manufacturing across a broad range of major OEM products.

We utilize our existing technical capabilities in design, technology components, and complex assembly, integration, and after-sales services to provide tailored solutions to our customers.

With our extensive market knowledge and global footprint, we can align these solutions to our facilities in each region around the world.

Our structure supports this strategy with global customer-centric account teams.

Each account team is led by a global account manager who is directly responsible for account management.

Global account managers coordinate the resources required to facilitate the customer-specific solutions.

As needed, these teams may include subject matter experts in design, specific technology components, services, products, and supply chain.

These teams create a hub for interaction between the customer and Sanmina locations, providing local support to customer worldwide.

For our integrated manufacturing solutions business, we face competition from other major global EMS companies such as Benchmark Electronics, Inc., Celestica, Inc., Flex Ltd., Hon Hai Precision Industry Co., Ltd.

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We believe the primary competitive factors in our industry include manufacturing technology, quality, global footprint, delivery, responsiveness, provision of value-added solutions and price.

We believe our primary competitive strengths include our ability to provide global end-to-end solutions, product design and engineering resources, vertically integrated manufacturing solutions, advanced technologies, global manufacturing capabilities, global supplier base, customer focus and responsiveness, expertise in serving diverse end markets, and expertise in industry standards and regulatory requirements.

We believe our primary competitive strengths include our ability to provide mission critical end-to-end solutions, product design and engineering resources, vertically integrated manufacturing solutions, advanced technologies, global manufacturing capabilities, global supplier base, customer focus and responsiveness, expertise in serving diverse end markets, and expertise in industry standards and regulatory requirements.

Intellectual Property

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For example, almost all of our manufacturing facilities are certified under ISO 14001, a set of standards and procedures relating to environmental compliance management.

In addition, the electronics industry must adhere to the European Union's Restrictions of Hazardous Substances (RoHS) and Waste Electrical and

Electronic Equipment (WEEE).

In addition, the electronics industry must adhere to the European Union's Restrictions of Hazardous Substances (RoHS) and Waste Electrical and Electronic Equipment (WEEE).

Parallel initiatives have been adopted in other jurisdictions throughout the world, including several states in the U.S.

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We continually monitor employee turnover rates, both regionally and as a whole, as our success depends upon retaining our highly trained manufacturing and operating personnel.

We believe the combination of competitive compensation and career growth and development opportunities have helped increase employee tenure and reduce voluntary turnover.

The average tenure of our employees is approximately eight years and more than one fourth of our employees have been employed by us for more than ten years.

We believe the combination of competitive compensation, career growth and development opportunities have helped increase employee tenure and reduce voluntary turnover.

The average tenure of our employees is approximately eight years and more than one third of our employees have been employed by us for more than ten years.

Hiring Practices

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Compared sentence by sentence after normalising whitespace, quotation marks, case and digits, so re-formatting and restated figures do not read as changed language. Wording changes appear as one removal and one addition. The current filing and the prior one are authoritative.

What changed 10-K

Item 1. Business